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SEMICON TECHNOLOGY JOINT STOCK COMPANY is distributors that provides solutions related to materials, equipments and chemicals in typical industrial sectors such as electronics, semiconductors, automobiles and aerospace. SEMICON always focuses on customers' benefits to become a reliable partner of global brands. We are bring products that optimizing performance, guaranteeing customers benefits, improving quality of life as well as sustaining an healthy environment for communities.

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Process flow

01 Preserving

This is the process of temporarily protecting the wafer surface or structure to prevent damage, scratches, or contamination during subsequent handling.

02 Lamination

In this step, a special protective film is laminated onto the wafer surface. The film secures and protects the wafer, keeping it stable during the dicing process.

03 Stealth Dicing

This is a laser-based dicing method. Instead of cutting directly, the laser focuses inside the silicon to create internal cracks, and the wafer is then separated along these lines. It minimizes dust, reduces mechanical stress, and is ideal for thin wafers.

04 Back Grinding

This process thins the backside of the wafer, reducing its thickness from about 700 µm to just a few dozen µm. Thinner wafers allow chips to be smaller and lighter, meeting the requirements of modern compact electronic devices.

05 Die Attach SSD

In this stage, NAND Flash chips or controllers are attached to the substrate of a solid-state drive (SSD) using specialized adhesive or solder. This ensures mechanical stability as well as good thermal conductivity.

06 Die Attach RAM

Similar to SSD assembly, DRAM dies are attached to the RAM module substrate. This process requires high precision to prepare for wire bonding or flip-chip interconnection, ensuring both performance and reliability of the RAM.